Al SiC (alluminum silicon carbide) is a metallic-based thermal management compound made up of silicon carbide and aluminum. It is used as a packaging material for electronic parts. The combination of aluminum with high volume frac is what it refers to.

Description Al/SiC

Al SiC (Al SiC), a metallic-based thermal management compound made up of aluminum and silica carbide, is an electronic packaging material. In order to prevent thermal failures in electronic circuits, it is the mixture of high volume silicon carbide and aluminum.

Specifications for Aluminum Matrix Composites

Materials		Density = g/cm3.	Modulus of Elasticity GPa	Strength MPa	Koefficient of extension 10-6 beats K	Thermo conductivity W/m
SiC/Al	15vol%SiC/Al	2.82	100+-5	560	17.0+-1	150+-5
	20vol%SiC/Al	2.85	110+-5	580	16.0+-1	160+-5
	25vol%SiC/Al	2.86	115+-5	600	14.3+-1	170+-5
	30vol%SiC/Al	2.89	125+-5	560	13.1+-1	175+-5
	45vol%SiC/Al	2.92	160+-5	500	11.5+-1	190+-5
	55vol%SiC/Al	2.95	195+-5	450	9.5+-1	200+-5
	60vol%SiC/Al	2.98	200+-5	420	8.3+-1	205+-5
	65vol%SiC/Al	3.01	215+-5	400	7.5+-1	210+-5
	70vol%SiC/Al	3.02	220+-5	380	7.0+-1	215+-5

Properties of Aluminum Silicon Carbide Aluminium/SiC

Silicon caride aluminum SiC/ Almatrix are excellent composites that have outstanding benefits, including low density and high specific stiffness. They also offer high thermal conductivity, low thermal expansion coefficient, and high stability.
Example: (1) Superior structural stability (static rigidity, dynamic stiffness), wherein the elastic modulus of titanium alloy is twice that of the aluminum alloy. Specific stiffness and specific stiffness are also three times higher than the aluminum alloy and titanium alloy. (2) High thermal control stability: The coefficient of thermal expansion of titanium alloy can be as low as 20%, while the temperature conductivity of the titanium alloy is 30%.

Aluminum Silicon Carbide - Al/SiC

Al/SiC meets the semiconductor integration needs according to Moore's law. This results in a dramatic increase in silicon chip calorific values, decreased service lives, and "light-weight and thin" electronic packaging development.

In aerospace especially, the use of microwave integrated circuits, power module, and military RF systems chips for packaging analysis has been a prominent trend.

Packing & Shipping of Aluminum Silicon Carbide Al/SiC :
You can choose from many kinds of packaging. Aluminum Silicon Carbide Al/SiC quantity.
Aluminum Silicon Carbide Al/SiC shipping: Send outs could be made by sea or air as soon as payment receipt is received.

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