What are the factors that affect the thermal conductivity of PCB aluminum nitride (AlN) ceramic substrate? aln ceramic


What are the factors that affect the thermal conductivity of PCB aluminum nitride (AlN) ceramic substrate? aln ceramic

(What are the factors that affect the thermal conductivity of PCB aluminum nitride (AlN) ceramic substrate? aln ceramic)

Light weight aluminum nitride (AlN), as a structurally secure hexagonal wurtzite covalently bonded compound, has shown large application potential in the fields of electronics and optoelectronics due to its distinct physical and chemical residential properties. Its crystal structure is based upon an AlN4 tetrahedron as the fundamental unit, with room team P63mc coming from the hexagonal crystal system. This structure gives AlN a series of exceptional buildings.

Main features of AlN ceramics

High thermal conductivity: Compared with alumina porcelains, the thermal conductivity of AlN is 5 to 10 times higher. Theoretically, the thermal conductivity of single crystal products at 300K can get to 319W/(m · K).

Thermal development matching: Its thermal expansion coefficient resembles that of semiconductor silicon materials, which contributes to tool integration.

Exceptional mechanical and electric properties: It has high insulation resistance and low dielectric loss and is suitable for high-reliability digital packaging.

Convenient for multi-layer electrical wiring: sustains miniaturization and high-density integration of product packaging.

Environmentally friendly: The safe characteristics satisfy contemporary environmental management needs.

(Aluminum Nitride (AlN) Crystal Structure)
Variables influencing the thermal conductivity of AlN porcelains

Although the academic thermal conductivity of AlN is exceptionally high, its performance in useful applications is limited by several elements, generally including:

1. Microstructure: Phonon scattering is the essential system of warmth transmission. Grain limits, interfaces, 2nd stages, defects, etc, will influence the mean cost-free course of phonons, thereby affecting thermal conductivity. High-purity, low-defect single-crystal AlN has a much longer phonon-free course and higher thermal conductivity.

2. Oxygen contamination material: The strong affinity of AlN with oxygen makes it easy to introduce oxygen contaminations, forming aluminum oxide movies and latticework problems, such as light weight aluminum jobs, which dramatically lower the mean free path of phonons and thus lower thermal conductivity. When the oxygen concentration is below 0.75%, oxygen atoms mostly replace nitrogen atoms; surpassing this focus will cause the loss of light weight aluminum vacancies and the generation of ductility issues, further influencing thermal conductivity.

3. Sintering procedure and additives: By picking ideal sintering ingredients (such as Y2O3-Li2O, Y2O3-CaC2 and other composite systems), densification sintering can be accomplished at a lower temperature while decreasing the development of oxygen pollutants and second phases, efficiently improving the thermal conductivity of AlN ceramics. The duty of these ingredients is to purify the grain boundaries, enhance the microstructure, and facilitate the effective transmission of phonons.

Comprehensive approach

(TRUNNANO Aluminum Nitride (AlN) Powder)

In order to get AlN ceramics with high thermal conductivity, it is necessary to consider the pureness of the product comprehensively, the sintering problems and the selection of additives to decrease inner issues, specifically to regulate the web content of oxygen contaminations and optimize the microstructure.

By carefully regulating the sintering process and embracing an effective composite sintering additive system, it is anticipated that the high thermal conductivity AlN substrate required for large production applications can be accomplished while making certain material performance. This is not only critical for boosting the heat dissipation performance of electronic tools, yet also provides a crucial material basis for advertising the growth of semiconductor innovation.

Supplier of Light Weight Aluminum Nitride AlN Powder

TRUNNANO is a supplier of 3D Printing Materials with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you want to know more about


What are the factors that affect the thermal conductivity of PCB aluminum nitride (AlN) ceramic substrate? aln ceramic

(What are the factors that affect the thermal conductivity of PCB aluminum nitride (AlN) ceramic substrate? aln ceramic)

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